HUNTSVILLE, AL – September 2026 – AGI Corporation, a U.S. manufacturer of tooling and automation for electronics manufacturing, is adding Microscreen’s MicroGlide Platinum heat-fused nano coating to its stencil offering through the recently formed Microscreen AGI Alliance (MAA).
MicroGlide Platinum is Microscreen’s premium heat-fused nano coating for SMT stencils. The coating reduces solder paste adhesion to the stencil and improves paste release from the apertures, helping reduce insufficient solder paste deposits and underside stencil cleaning. It is particularly well suited for fine-pitch and small-aperture printing.
Unlike spray-on or wipe-on coatings, MicroGlide Platinum is heat-fused to the stainless steel stencil surface. The process creates a durable bond designed for longer coating life without cracking, chipping or flaking.
“This is one of the reasons we formed MAA,” said Todd Gilmore, President of AGI Corporation. “Microscreen already has the nano coating process and experience in place, and now we can offer that to our stencil customers.”
AGI plans to add MicroGlide Platinum application and curing equipment at its Huntsville, Alabama, and Richardson, Texas, manufacturing facilities later this year. The equipment will allow AGI to apply MicroGlide Platinum to stencils at both locations using Microscreen’s established process and advanced nano coating expertise.
The addition follows the recent launch of MAA by AGI and Microscreen. Through the alliance, AGI provides its PCB tooling and engineering capabilities to Microscreen customers, while Microscreen provides its MicroGlide process and advanced nano coating expertise to AGI. Both companies remain independently owned and continue to manufacture and sell their own products.
AGI Corporation designs and manufactures assembly tooling, test fixtures and automation used in electronics manufacturing. With extensive PCB tooling and integration experience, the company serves EMS, automotive, medical and mil-aero customers throughout North America.