Processing Speed

Stencils up to 28000 apertures/Hr

Processing Speed

Wafer bumping up to 45000 apertures/Hr

Axis travel

up to 610x830 (mm)

makes 23x27” remountable foils in one process

Material thickness capability

Up to 0.4mm (stainless)

Maximum speed

3M/s

Resolution

0.01 Microns

Repeatability

0.5 Microns

Laser

150W air cooled Fiber

Max Frame size

29” x 34”

Motion system

Linear motor gantry with glass scales

Assist gas

Compressed air