Features and Benefits

Solder pallets offer many advantages to the cost conscious Process Engineer. These advantages can usually pay back in a few weeks with cost savings and improved yields. By deploying a double reflow process, you can maximize your yields through the wave solder process.

Other advantages are:

• Step Cutting, also known as Pocketing, on the top side, we remove only the material needed to clearance for bottom side SMD's, leaves more material in place for rigidity and future proofing your tools. 

• By leaving a radius in the inner seal wall, we can reliably machine the 'seal' wall down to .030" thick without sacrificing strength. (0.050" - 0.075" typical seal wall thickness)

• Bottom side Pressure Relieving improves solder flow by reducing the "Z" height and allowing the wave time to stabilize.

• All hold downs are injection molded and made from high temperature, ESD safe plastic. AGI guarantees the hold downs for the life of the pallet!

• AGI does not tap the composite for hold down installation. All hold downs are installed with metal to metal fasteners to ensure a reliable and long lasting fixture.

• We only use 316 Grade Stainless Steel hardware on our pallets. 

• We offer Optical grade Lead Free Composites for Wave Solder, we typically use CAST Aluminum with Hard Anodize for selective solder pallets.

Canopy Systems

• Hinged Canopies with our Inverted Slam Latch System offer one handed operation

• We can include PEEK mesh in the canopy to reduce Foreign Material and allow heat to easily pass through. 

• Lift Off Canopies are an economical way to secure components, including components close to the board edge. 

• All canopies can be fitted with our spring plungers made from High Temp ESD plastic. We offer a number of spring rates to achieve the Holding force needed as well as optional Brass Bushings for smooth operation. 

Titanium Inserts for Solder Pallets

AGI now manufactures Titanium Selective Solder Pallets utilized for difficult wave soldering applications.  These applications include PCB’s that are designed with plated through hole components in very close proximity to bottom side SMD’s.  By machining titanium vs. composites, AGI can achieve ‘seal walls’ down to .020 inches thick standard and as small as .015 inches thick over short distances.

AGI’s design is based upon machining a single piece of titanium to match the PCB and incorporate that into a composite pallet frame.  By doing this, the heat is distributed evenly across the PCB during the solder process. By avoiding using small titanium inserts screwed to the pallet; we avoid the issues of leaking, alignment and thermal mismatch. The composite frame runs much cooler than the titanium coming out of the wave, so it is easier to handle or convey after soldering. The titanium pallet design includes many of the proven AGI designs for low defect wave soldering.

• Machined Titanium Inserts are commonly used in tight areas.
• For small complex PCBs we offer a (1) piece Titanium design which prevents leaks and alignment issues.
• Composite frame reduces thermal load in wave, cooler and lighter.
• Seal Walls down to .020 inches thick standard.
• Seal Walls down to .015 inches thick for short distances.
• Titanium ensures long life for high volume applications.
• Ideal for soldering very challenging mixed technology boards.